Выставка Еда, напитки, упаковка Advanced System in Package Technology Conference & Exhibition 2023

The Advanced System in Package Technology Conference & Exhibition will showcase the latest developments, solutions, and trends in SiP technology. It will feature presentations from global experts in areas such as cellular, IoT, automotive, computing, and networking. The event will cover various SiP subsets including laminate/glass/ceramic/silicon/leadframe-based SiP, Fanout SiP, Heterogeneous integration, 2.5D/3D SiP, and modules. Advanced SiP encompasses microelectronic system design and system integration in a package.