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About event
Bondexpo — the platform for adhesive technology. The importance of adhesives and adhesive technologies as a construction element in the area of joining and its extended functions is totally underestimated to this day. The same can be said about the possibilities for rationalisation that the use of adhesives and adhesive technology opens up. The new expert trade fair Bondexpo looks at these issues and for the first time presents the entire world of adhesive technology to an expert audience. The new trade fair Bondexpo has been designed to be a practical sector to get-together, intended to introduce customers and professional operators to the varied uses and application possibilities of adhesives. Whether manufacturers of adhesives, sealants and sealing compounds or suppliers of dosing and application installations — the Bondexpo is the only sector platform worldwide and brings together suppliers and users. While a thoroughly worked-out glossary ensures the necessary «grip keeps feet on the ground», a selection of peripheral seminars and expert lectures guarantees interesting and comprehensive information is at hand.
Venue
Address: Stuttgart, Germany